The Versatile-GN200 is a high-rigidity and high-precision wafer grinder. Developed for the power semiconductor device . Adopting a novel layout, this equipment supports grinding on wafers of various material including Si, SiC, LiTaO?, and LiNbO?. Compatible with 4/6/8-inch wafers,Capable of integrated, it achieves fully automated processing including precise positioning, precision thinning, and double-sided cleaning/drying in a single workflow. Leveraging high-precision online measurement and exceptional surface profile control technology, the equipment achieves high-precision thinning, accommodating the ultra-precision wafer thinning requirements of the power semiconductor device.
High-rigidity and high-precision
Grinding for multiple wafers' material ,Si ,SiC,LiTaO3,LiNbO3
Compatible with 4/6/8-inch wafers
?High Automation，High Integration Density?
High-precision online measurement and exceptional surface profile control technology