The Universal-S300 is a 12-inch CMP equipment developed by Hwatsing to meet industry-leading demands, integrating advanced polish-processes, high efficiency, and exceptional stability. This tool is equipped a stacked layout architecture to achieve high production capacity within limited machine space, equipped with an efficient transport and clean-system. Its modular design accommodates diverse customer requirements for different processes, meeting the growing need for enhanced cleanliness. The Universal-S300 enables superior global nanoscale planarization of wafers, fulfilling the requirements of advanced process technologies and enabling mass application in manufacturing processes such as integrated circuits and advanced packaging.
Stacking construction for polisher and cleaner ,to achieve maximum production capacity with compact layout
Modular configuration, for 4 platen or 6 platens
Polisher configured with 1：1 or 2：3 for palten：head optionally, meeting customers' diverse process requirements such as high production capacity and high precision
Efficient transfer- path designed significantly improves the transmission speed from polisher to cleaner
Buff clean chamber utilizes mechanical shear-force and chemical reactions to enhance surface particle cleaning capability