The Versatile-GM300CMP is a fully automaticwafer Grinder/Polisher and mounter independently developed by Hwatsing.This equipment is designed to meet the full-process requirements of wafer backside thinning, enabling integrated operations for wafer backside grinding, polishing, and tape-peeling, thereby significantly improving operational efficiency and process stability. It employs a combination of coarse grinding, fine grinding, and wet polishing to achieve superior wafer surface quality. The innovative four-plate three-axis platform ensures stable compatibility with both 8-inch and 12-inch wafers. Additionally, the integrated high-purity cleaning module significantly enhances wafer cleanliness in single-machine operation mode. The Versatile-GM300CMP supports a variety of materials, including Si, SiOx, EMC, LT, and LN, catering to diverse process development needs in advanced packaging, MEMS, and other fields.
Rough grinding,fine grinding and wet polishing combined process for superior surface quality
Optional high-clean unit: cleanliness of non-film-coated products meets ?Fab cleanliness level
Optional warped wafer handling kit,adapting to the operation requirements of high-warpage wafers in advanced packaging