Versatile-DT200 is a high-efficiency, high-cleanliness fully automatic dual-wafer edge trimming equipment independently developed by Hwatsing. It is designed to precisely solve edge chipping during wafer thinning, thereby improving thinning quality.Versatile-DT200 combines cutting, transfer, cleaning, and measurement functions. It features multi-axis high-precision cutting technology, fully automatic transfer, high-cleanliness technology, and is equipped with high-resolution visual alignment and advanced measurement systems. Additionally, the equipment offers flexible size switching, diverse process options, and versatile functional configurations, making it highly suitable for advanced packaging, Micro LED, compound wafer, and other semiconductor manufacturing processes and products.
Compatible with 6/8/12-inch wafers
Supporting various products
High-resolution visual alignment and in-situ measurement?
Fully automatic transfer and high cleanliness