The HSC-D3812 is a next-generation single-wafer cleaning platform developed by Hwatsing for advanced process node. Featuring a dual-layer isolated architecture, advanced multi-chemical processing capability, and exceptional scalability of up to 20 chambers, it delivers throughput of up to 1,000 WPH, providing customers with a new standard in high-efficiency wafer cleaning solutions.
Advanced single-wafer cleaning platform for 12-inch IC fabrication,advanced packaging,and wafer manufacturing
Flexible and expandable chamber configuration supporting up to 20 process chambers
Multi-chemical capability with up to five process chemicals per chamber and integrated reclamation for up to two chemicals
Dual isolated cleaning layers with dedicated transfer robots for zero cross-contamination between different product types
High-speed wafer-handling robots delivering up to 1,000 wafers per hour throughput for high-volume manufacturing